CLEANING SOLUTIONS INCLUDING PRESERVATIVE COMPOUNDS FOR POST CMP CLEANING PROCESSES

摘要

Post CMP cleaning solutions are provided including at least one cleaning agent comprising an organic acid compound, at least one preservative compound that substantially minimizes or prevents microbial growth in the cleaning solution, and at least one amine compound. The preservative compound can be another organic acid compound that protects the cleaning solution against microbial growth. The cleaning solutions preferably have a pH ranging from about 2 to about 7.