Acidic Cleaning Solutions for Post InGaAs CMP Cleaning(PPT)

机译：酸型CMP清洗后的酸性清洁溶液（PPT）

获取原文

页面导航

摘要
著录项
相似文献
相关主题

摘要

1.Introduction.1.1 High mobility semiconductor for Logic Device.2.Research objective.3.Experimental procedure.4.Results and discussion.4.1 Evaluation of etch rate.4.2 Component analysis.4.3 Zeta potential measurement.4.4 PRE(Particle Removal Efficiency)Analysis.5.Summary.

机译：1.逻辑仪器的简介.1.1逻辑设备的高迁移率半导体..Research目标.3。实验性步骤.4.4。结果和讨论.4.1蚀刻速率的评估。4.2分量分析.4.3 Zeta电位测量.4.4前（颗粒去除效率）分析.5.summary。

著录项

来源
《Surface Preparation and Cleaning Conference》|2018年|297 p.|共11页
会议地点
作者
Jin-Goo Park; Hyun-Tae Kim; In-chan Choi;
展开▼
作者单位

展开▼
会议组织
原文格式 PDF
正文语种
中图分类工程材料学;
关键词

相似文献

外文文献
中文文献
专利

1. The effect of citric acid based cleaning solution on particle adhesion and removal during post-Cu CMP cleaning [J] . Zhang Lifei, Wang Tongqing, Lu Xinchun Microelectronic Engineering . 2019,第AUGa期

机译：柠檬酸基清洗液对铜后CMP清洗过程中颗粒附着和去除的影响
2. Effect of EDTA-based alkaline cleaning solution on TAZ removal in post CMP cleaning of copper interconnection [J] . Yin Da, Wang Qi, Zhang Shihao, Materials Research Bulletin . 2021,第May期

机译：EDTA基碱性清洁溶液对CMP铜互连后CMP清洗中的TAZ去除的影响
3. Degradation of inhibitor in alkaline cleaning solution for post-Cu CMP cleaning [J] . Lai Shin-Mei, Chen Yin-Ying, Liu Chien-Pan, Surface & Coatings Technology . 2018,第期

机译：CU CMP清洗后碱性清洁溶液中抑制剂的降解
4. Acidic Cleaning Solutions for Post InGaAs CMP Cleaning(PPT) [C] . Jin-Goo Park, Hyun-Tae Kim, In-chan Choi Surface Preparation and Cleaning Conference . 2018

机译：酸型CMP清洗后的酸性清洁溶液（PPT）
5. Development of Formulations for a-SiC and Manganese CMP and Post-CMP Cleaning of Cobalt. [D] . Lagudu, Uma Rames Krishna. 2014

机译：开发用于a-SiC和锰CMP的配方以及CMP后的钴清洗。
6. Evaluation of the smear layer removal and erosive capacity of EDTA boric acid citric acid and desy clean solutions: an in vitro study [O] . Tugba Turk, Mehmet Emin Kaval, Bilge Hakan Şen 2015

机译：评估EDTA硼酸柠檬酸和desy清洁溶液的污点去除和侵蚀能力：一项体外研究
7. Comparison of Novel Cleaning Solutions With Various Chelating Agents for Post-CMP Cleaning on Poly-Si Film [O] . Tung Ming Pan, Tan Fu Lei, Fu Hsiang Ko, 2016

机译：新型清洗液与各种螯合剂的比较，用于多晶硅薄膜的Cmp后清洗

Acidic Cleaning Solutions for Post InGaAs CMP Cleaning(PPT)

摘要

著录项

相似文献

相关主题

期刊订阅