首页> 外国专利> METHOD OF FORMING AN INVERTED T SHAPED CHANNEL STRUCTURE FOR AN INVERTED T CHANNEL FIELD EFFECT TRANSISTOR DEVICE

METHOD OF FORMING AN INVERTED T SHAPED CHANNEL STRUCTURE FOR AN INVERTED T CHANNEL FIELD EFFECT TRANSISTOR DEVICE

机译:倒T形场效应晶体管器件的倒T形通道结构的形成方法

摘要

A method of forming an inverted T shaped channel structure having a vertical channel portion (314) and a horizontal channel portion (322) for an Inverted T channel Field Effect Transistor ITFET device comprises providing a semiconductor substrate (302), providing a first layer (304) of a first semiconductor material over the semiconductor substrate (302), and providing a second layer (306) of a second semiconductor material over the first layer. The first and the second semiconductor materials are selected such that the first semiconductor material has a rate of removal which is less than a rate of removal of the second semiconductor material. The method further comprises removing a portion of the first layer (304) and a portion of the second layer (306) selectively according to the different rates of removal so as to provide a lateral layer (312) and the vertical channel portion (314) of the inverted T shaped channel structure and removing a portion of the lateral layer (312) so as to provide the horizontal channel portion (322) of the inverted T shaped channel structure.
机译:一种形成具有用于反向T沟道场效应晶体管ITFET器件的垂直沟道部分(314)和水平沟道部分(322)的反向T形沟道结构的方法,该方法包括提供半导体衬底(302),提供第一层( 304)在半导体衬底(302)上提供第一半导体材料,并在第一层上提供第二半导体材料的第二层(306)。选择第一半导体材料和第二半导体材料,使得第一半导体材料具有的去除速率小于第二半导体材料的去除速率。该方法还包括根据不同的去除速率选择性地去除第一层(304)的一部分和第二层(306)的一部分,从而提供侧向层(312)和垂直通道部分(314)。倒T形通道结构的一部分被去除,并去除部分侧向层(312),从而提供倒T形通道结构的水平通道部分(322)。

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