CMP SLURRY COMPOSITION AND PROCESS FOR PLANARIZING COPPER CONTAINING SURFACES PROVIDED WITH A DIFFUSION BARRIER LAYER

摘要

A CMP slurry composition for planarizing surfaces comprising copper and a diffusion barrier layer comprising: an abrasive, an oxidizer, a corrosion inhibitor, amonomeric polyhydroxy compound, a base, the slurry composition having a pH of from 7 to 13