METHOD FOR LIFT-OFF PATTERNING FILMS ON A SUBSTRATE

摘要

A method of performing lift-off patterning process is disclosed which involves dry resist film or lithography and material deposition process followed by lamination with UV sensitive or equivalent adhesive film and then delaminating the top layer of thin film due to weak adhesion of deposited material with the underlying organic layer. In an embodiment, the unwanted dry resist film is stripped or peeled-off by again laminating a fresh layer of UV sensitive film and delaminating the unwanted dry resist film mask. As the sputtered or evaporated films are usually non-conformal, the thin and weakly adhered sidewall metal films easily gets delaminated by the polymer film during the delamination process and thus resulting in smooth edges for the metal patterns.