HEATSINK, COOLING MODULE, AND COOLABLE ELECTRONIC BOARD

摘要

A heatsink (10) is provided with a base body (11) opposed to a heat generating body (14) and absorbing heat from the heat generating body (14). Thermal resistance of that opposed portion (12) of the base body (11) which is opposed to the heat generating body (14) is higher than thermal resistance of a surrounding portion (13) surrounding the opposed portion (12).