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A NOZZLE FOR SUPPLYING SOLUTION AT SEMICONDUCTOR WAFER MANUFACTURING, AND APPARATUS FOR CLEANING WAFERS
A NOZZLE FOR SUPPLYING SOLUTION AT SEMICONDUCTOR WAFER MANUFACTURING, AND APPARATUS FOR CLEANING WAFERS
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机译:用于在半导体晶圆制造中提供解决方案的喷嘴以及用于清洁晶圆的装置
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摘要
A solution spread through nozzle of the spiral structure. Accordingly, the solution having torque generated by the spiral structure can improve the wafer cleaning capability. The injection hole(250) is located at the surface contacting with the wafer and the sprays the solution. The spiral structure is positioned at the upper portion of one or more injection holes. The spiral structure may have different diameters and the holes of the spiral structure may have different diameters.
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