SEMICONDUCTOR PACKAGE INSPECTION SYSTEM AND INSPECTION METHOD USING SEMICONDUCTOR PACKAGE INSPECTION SYSTEM

摘要

A semiconductor package check system and an inspecting method by the semiconductor package check system is provided to produce the semiconductor package of the good state by discrete inspection as the pad, ball, lead and wire etc. of the semiconductor package are classified and individually inspected. A semiconductor package check system(A) comprises a ball camera(20), the wire camera(30) and stitch camera(40) about the semiconductor package. The ball camera comprises a ball photographing camera(21). The ball camera takes a photograph of pad and ball of the semiconductor package and produces a ball video signal including the image of ball and pad. The lead of the semiconductor package, and the wire photographing camera(31) are equipped in the wire camera. The wire photographing camera takes a photograph of pad and wire and produces wire video signal including the image of the lead, the wire and pad. In the stitch camera, the stitch photographing camera(41) is equipped. The stitch photographing camera takes a photograph of the lead and wire of the semiconductor package and produces a stitch video signal including the image of the wire and lead. The work table(13) moves the semiconductor package to the ball camera, the wire camera and stitch camera. The microprocessor(11) controls the ball camera, wire camera and stitch camera. Microprocessor comprises a video signal input(14) and memory unit(15). The video signal about the semiconductor package is input to the video signal input and memory unit from the ball camera, wire camera and stitch camera.