3D Inspection of Semiconductor Packages for High-Throughput Applications

摘要

3D imaging is essential for viewing interconnects on semiconductor packages and for determining whether or not the parts "pass" or are rejected for assembly. Crucial to any inspection system, in addition to accuracy, robustness, and reliability, is the need to maintain throughput for the packaging line. This can be accomplished either with an in-line system or with a semi-automated batch station, as long as the processing speed for the inspection equipment is not limiting. Previously, inspection was accomplished using stereovision, laser trian-gulation, or confocal imaging, each of which has limitations. FMI, as an enhancement of traditional moire inter-ferometry, offers higher accuracy and significantly faster processing speed than the above technologies. As a result, FMI is unaffected by the limitations of conventional inspection technologies and, as a result, offers component manufacturers a far superior strategy for quality control.