ELECTROLESS COPPER PLATING SOLUTION FOR EMI SHIELDING MATERIAL AND PROCEE OF MANUFACTURING PRODUCT

摘要

An electroless copper plating solution for EMI shielding material is provided to improve stability of the plating solution by adding fluoride compound, benzo compound and cyanide compound to assisted stabilizer. An electroless copper plating solution for EMI shielding material uses: ethylene diamine tetracetic acid(EDTA) or sodium salt of the ethylene diamine tetracetic acid or amine salt of the ethylene diamine tetracetic acid, ethylenediamine pentaacetate(EDPA), sodium salt of the ethylenediamine pentaacetate, amine salt of the ethylenediamine pentaacetate, ethylene diamine tetra propanol(EDTP) or sodium salt of the ethylene diamine tetra propanol or amine salt of the ethylene diamine tetra propanol as a complexing agent; a first class alcohol or a second alcohol and 2,2- dipyridyl as stabilizer.