SYSTEM FOR REMOVING PARTCLE OF WAFER'S BACK SIDE AND METHOD FOR REMOVING PARTCLE OF WAFER'S BACK SIDE IN STEPPER

摘要

A kind of system, for remove a wafer backside particle and a kind of method, for removing particle, by from (directional plane) table remove particle from a wafer holder be arranged to remove a chip step. The lower part of one jack works part (20) has the L shapes being mounted on a chip, and the top of jack works is linked to the loader side unit (10) an of steeper. In a load slide part transferring plates a to wafer holder for the load side of steeper, magnetic field occurs unit (30) and is formed in the rear side of chip and generates magnetic field. One bracket (40) supports magnetic field that unit occurs, it moves up and down magnetic field and unit occurs.