ADHESIVE FILM FOR DIE BONDING IN SEMICONDUCTOR ASSEMBLY AND DICING DIE BONDING FILM COMPRISING THE SAME

摘要

An adhesive film for die bonding in a semiconductor assembly is provided to prevent burrs generated through deformation of an adhesive film due to excellent cuttability and flexibility and to ensure excellent pick-up property. An adhesive film for die bonding in a semiconductor assembly has 50-150 % of elongation at break measured at 1000 mm/min tension rate in a tension condition of 25°C and 10-1000 mm/min, and satisfies chemical formula: (E10-E1000 ) / (log10 10 - log10 1000) = -200 together with elongation at break E100 at 10 mm/min tension rate of elongation at break E1000. The adhesive film composition for die bonding in a semiconductor assembly comprises an acrylic polymer 10-85 weight%, epoxy resin 5-40 weight%, phenol type hardened resin 5-40 weight%, curing catalyst 0.01-10 weight%, silane coupling agent 0.01-10 weight% and filler 0.1-60 weight%.