METHOD FOR FABRICATING OF REDISTRIBUTION LAYER OF SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING OF STACK PACKAGE OF THE SAME

摘要

A kind of method, for manufacture a semiconductor chip redistribution layer and a kind of method, for manufacturing the form metal mode on each semiconductor chip being provided in one process using identical stack package, thus simplify stack package manufacturing step. A kind of method, the redistribution layer for manufacturing a semiconductor chip include the following steps:: one chip of saw work band saw adhered thereto being used on a chip (120); Tensile stress is applied to the interval that saw work band extends the semiconductor chips seen; A metal mold (140) are formed on the interval of the semiconductor chips of extension, wherein metal mold is electrically connected to the semiconductor chips seen; Cutting metal conducting wire separating semiconductor sheet body; From saw work band separating semiconductor sheet body.