PHOTOSENSITIVE RESIN COMPOSITION, PHOTO SPACER AND FORMING MATHOD THEREOF, PROTECTION FILM, COLORED PATTERN, SUBSTRATE FOR DISPLAY DEVICE, AND DISPLAY DEVICE

摘要

A photosensitive resin composition is provided to form a pattern structure or a protective film without low heating temperature or heat treatment. A photosensitive resin composition comprises a resin, a polymerizable compound and a photopolymerization initiator. The dipole moment the polymerizable compound is 3.50Debye or greater. The polymerizable compound has a five-membered or six-membered ring structure and an ethylenically unsaturated double bond. The five-membered or six-membered ring structure has a connection part including C=O and a connection part including P=O.