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APPARATUS FOR INSPECTING EDGE AREA OF WAFER, METHOD USING THE SAME, AND METHOD FOR ALIGNING WAFER
APPARATUS FOR INSPECTING EDGE AREA OF WAFER, METHOD USING THE SAME, AND METHOD FOR ALIGNING WAFER
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机译:晶圆边缘检测装置,使用该晶圆边缘的方法以及晶圆晶圆化方法
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摘要
An apparatus for inspecting edge area of a wafer, method using the same, and method for aligning the wafer are provided to improve the accuracy and repetition of rotation center by obtaining an image of a wafer and aligning rotation center. In an apparatus for inspecting edge area of a wafer, method using the same, and method for aligning the wafer, a wafer chuck is mounted on an upper side and is rotatable around a central axis. A wafer alignment unit turns the wafer mounted on the wafer chuck around the central axis of the wafer. A first image pickup unit is arranged on an upper part of the wafer and obtains an edge image of the wafer. A controller determines a defect of the wafer to be tested, and the wafer alignment unit is composed of a first image pickup unit(131), a lighting unit(154), and a wafer chuck driving part.
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