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Nonvolatile semiconductor memory device having gate stack comprising OHAOxide-Hafnium oxide-Aluminium oxide film and method for manufacturing the same
Nonvolatile semiconductor memory device having gate stack comprising OHAOxide-Hafnium oxide-Aluminium oxide film and method for manufacturing the same
Provided is a nonvolatile semiconductor memory device including a semiconductor substrate having a source region and a drain region separated by a predetermined distance, and a gate stack formed between the source region and the drain region on the substrate, one end of the gate stack contacting the source region and the other end of the gate stack contacting the drain region, wherein the gate stack includes: a tunneling film (42); a first trapping material film (44) doped with a predetermined first doping impurity having a higher dielectric constant than a nitride film (Si 3 N 4 ); a first insulating film (46) having a higher dielectric constant than a nitride film; and a gate electrode (48), all of which are deposited sequentially on a substrate. The first three films of the gate stack may comprise OHA (Oxide-Hafnium oxide-Aluminum oxide) materials. There is provided a nonvolatile semiconductor memory device capable of effectively controlling the trap density according to the doping concentration, thereby increasing the write/erase speed of data at a low operating voltage.
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机译:提供一种非易失性半导体存储器件,包括:半导体衬底,其具有以预定距离隔开的源极区和漏极区;以及栅极叠层,该栅极叠层形成在基板上的源极区和漏极区之间,该栅极叠层的一端接触该栅极叠层。源极区和栅极叠层的另一端接触漏极区,其中,栅极叠层包括:隧穿膜(42);和掺杂有预定的第一掺杂杂质的第一捕获材料膜(44),该预定的第一掺杂杂质的介电常数比氮化物膜(Si 3 N 4)高。具有比氮化膜高的介电常数的第一绝缘膜(46);栅电极(48)和栅电极(48)被依次沉积在基板上。栅极叠层的前三层膜可以包含OHA(氧化物-氧化H-氧化铝)材料。提供了一种非易失性半导体存储器件,其能够根据掺杂浓度有效地控制陷阱密度,从而在低工作电压下提高数据的写入/擦除速度。
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