首页> 外国专利> RESIN-COATED METAL PLATE AND METHOD OF DRILLING PRINTED WIRING BOARD USING THE METAL PLATE

RESIN-COATED METAL PLATE AND METHOD OF DRILLING PRINTED WIRING BOARD USING THE METAL PLATE

机译:树脂涂层金属板及使用该金属板钻孔印刷线路板的方法

摘要

According to the invention, the high smoothness superior drill penetration rate drilling a hole in the side of the inner wall, the distance between the generated volume large and the adjacent drilling holes of high quality under high-density drilling conditions is reduced compared to the (pitch) is short and damage potential drilling and a resin used as a high efficiency for drilling the printed wiring board that can be provided to correct position-coated metal plate is provided; By using a metal plate it is provided a method for drilling a printed wiring board. The resin used as the protective backing after the drilling of the printed wiring substrate-coated metal sheet comprising a resin film comprising a thermoplastic resin which is coated on at least one surface of the metal plate and the metal plate; In the thermoplastic resin, the melting peak temperature is in the range of 60 ℃ to 120 ℃, from the TMA curve, while the temperature difference is that the penetration of the probe changes in a temperature range of 20 ℃ to 200 ℃ to 100% from 10% of the resin thickness within a period of in the range of 5 ℃ to 30 ℃. ; Resin-coated metal plate, a printed wiring board, and then protective backing plate, metal plate, a resin film
机译:根据本发明,与()相比,减小了在内壁侧面钻洞的高光滑度优良的钻头穿透率,减小了在高密度钻探条件下产生的体积大和相邻的高质量钻眼之间的距离。间距短),具有潜在的破损钻孔性,并且提供了一种树脂,该树脂被用作钻孔效率高的树脂,该印刷电路板可被提供以校正位置涂覆的金属板;通过使用金属板,提供了一种在印刷线路板上钻孔的方法。在对印刷线路板涂覆的金属板进行钻孔之后用作保护性背衬的树脂,该金属板包括在金属板和金属板的至少一个表面上涂覆有包含热塑性树脂的树脂膜。在热塑性树脂中,根据TMA曲线,熔融峰值温度在60℃至120℃的范围内,而温度差则是探针的针入度在20℃至200℃到100%的温度范围内变化在5℃至30℃的范围内,树脂厚度的10%会从10%降低到10%。 ;树脂涂层金属板,印刷线路板,然后是保护性背板,金属板,树脂膜

著录项

  • 公开/公告号KR100886562B1

    专利类型

  • 公开/公告日2009-03-02

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20070086334

  • 申请日2007-08-28

  • 分类号B26F1/16;H05K3/00;

  • 国家 KR

  • 入库时间 2022-08-21 19:12:07

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