Review of 'Direct Plate' Processes & Assessment Of the Impact on Primary Imaging of Printed Wiring Boards

摘要

Environmental, cost, and performance criteria are providing the impetus for printed wiring board (PWB) fabricators to evaluate and adopt direct plate processes as replacement for the traditional electroless copper metallization of conductor vias. This paper surveys direct plate processes and their advantages and disadvantages compared to the electroless copper process. Special emphasis is given to the impact of direct plate processes on the application and processing of photoresists. Surface preparation and other processing requirements are discussed.