首页> 外国专利> RESIN-COATED METAL PLATE AND METHOD OF DRILLING PRINTED WIRING BOARD USING THE METAL PLATE

RESIN-COATED METAL PLATE AND METHOD OF DRILLING PRINTED WIRING BOARD USING THE METAL PLATE

机译:树脂涂层金属板及使用该金属板钻孔印刷线路板的方法

摘要

A resin-coated metal plate and a method of drilling a printed wiring board using the metal plate are provided to form holes, whose inner wall is slick, close to each other on the printed wire board. A resin-coated metal plate(1) is used for a protection rear plate in drilling a hole(14) on a printed wiring board(10). The metal plate includes a resin film(2) including a thermoplastic resin coated on at least one surface of a metal plate(3). The melting peak temperature of the thermoplastic resin ranges 60‹C to 120‹C. In a TMA(Thermal Machine Analyzer), temperature difference ranges 5‹C to 30‹C within 20‹C to 200‹C of temperature range when a probe passes through the thermoplastic resin while resin thickness changes 10% to 100%. The thickness of the resin film ranges 30mum to 300mum. The metal plate is 50mum to 300mum thick.
机译:提供树脂涂覆的金属板和使用该金属板钻制印刷线路板的方法,以在印刷线路板上形成彼此靠近的内壁光滑的孔。涂覆树脂的金属板(1)在印刷线路板(10)上钻孔(14)时用作保护后板。金属板包括树脂膜(2),该树脂膜包括涂覆在金属板(3)的至少一个表面上的热塑性树脂。热塑性树脂的熔融峰值温度为60℃至120℃。在TMA(热机分析仪)中,当探头穿过热塑性树脂而树脂厚度变化10%至100%时,温度差在20°C至200°C范围内,在5°C至30°C之间。树脂膜的厚度为30μm至300μm。该金属板的厚度为50μm至300μm。

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