LAM RESEARCH TCP/RAINBOW SERIES ELECTRO STATIC CHUCK DECHUCKING KIT

摘要

the present invention is a semiconductor device which LAM Research TCP / Rainbow Series device of an electrostatic chuck (Electro Static Chuck: attached to a completely de-chucking the wafer (Wafer) on the core component) to be fixed to the substrate in the lower electrode with the force of the static electricity (Dechucking: a substrate that has been fixed by electrostatic force to the substrate holding device, such as an electrostatic chuck from the chuck that relate to off action) of dechucking device (Dechucking Kit). ; conventional devices do not have a separate device for dechucking (Dechucking) to the wafer (Wafer) Process (Process) The end the wafer (Wafer) got residual electrostatic force remains between the electrostatic chuck (ESC) and the wafer (Wafer) When the dechucking (Dechucking) has not been completely taken out from the processing chamber when the (Chamber) wafer (Wafer) is an electrostatic chuck ( This phenomenon stick to ESC) are generated support (Lifter) by the power wafer (Wafer) This phenomenon is being broken or sticking up position deviation occurs when the top was up. This was a problem importing the equipment utilization rate decreased and decreased productivity of semiconductor manufacturing operations. ; electrostatic chuck (ESC) if the process proceeds (Process) has been completed for this purpose in the present invention are the treatment chamber (Chamber) The residue was left by giving electrostatic force by using the de-chucking device (Dechucking Kit) was fully removed through the ground it is possible to implement the complete de-chucking (Dechucking) a. ; This wafer was attached to the electrostatic chuck (ESC) (Wafer) is completely apart from the electrostatic chuck (ESC) and de-chucking (Dechcuking) Bad support (Lifter) that were generated during the rising problems (broken wafers and it is possible to be out completely solve the displacement) for the rise. ; Thus, the present invention is only the effect of improving the productivity and the rate of operation of the semiconductor process using a LAM Research TCP / Rainbow Series device well, is done using the domestic technology in localization skills in the domestic semiconductor industry has a huge effect.