Soldering material for increasing durability of soldering zone soldering method using the same

摘要

When the present invention is to lower the solder solidification thermal diffusivity by putting nanoparticles in solder solidification rate slows , thus providing a thermal deformation, soldering material for soldering portion durability can be suppressed as much as possible the occurrence of cracks and a soldering method using the same that occurs during soldering. The soldering material is very small particle sizes to be incorporated in the braze alloy to phonons (Phonon) scatter ( ) as the heat energy generated in the carrier and solder alloy for soldering of lead and tin as a main component according to the invention by phonons (Phonon) configured to include a base with the nanoparticles for scattering and, in carrying out the soldering by using this, ) phonon scattering for the nanoparticles to the solder using a soldering material in solid form comprising after soldering by performing soldering on how to include nanoparticles for the phonon scattering over the junction through the solder and, ) phonon scattering rear nanoparticles for which the solder is applied in advance of the normal Sn-Pb-based solder object naejineun there is a method that allows for using the solder alloy of Sn-Ag based lead-free (Pb-free) containing the nanoparticles for the phonon scattering in the brazing material of the junction by performing soldering.