Printed circuit board comprises insulating material, through-contact that is formed on given location of insulating material, and copper seeding layer that is formed with through-contact

摘要

The printed circuit board comprises an insulating material (110). A through-contact is formed on a given location of the insulating material. A copper seeding layer (114) is formed with the through-contact by an ion beam surface treatment and by a vacuum coating on a surface of the insulating material. A copper plating layer pattern (114a) is formed on a given area of the insulating material, on which the copper seeding layer is formed. The insulating material is a thermoplastic polyimide. A thickness of the insulating material is 25 microns. An independent claim is included for a method for manufacturing a printed circuit board.