Characteristic process parameter e.g. uniformity, determining method for quality assurance of chemical mechanical polishing process in semiconductor industry, involves correlating data on relevant process parameter of polishing process

摘要

The method involves performing statistic evaluation of temporal characteristics of a composition of waste water in polishing machines. Data is correlated on relevant process parameter of a polishing process. Total solid in the waste water is determined. Backscattering and/or reflection of individual wavelengths or a spectrum of light in the waste water is determined. Different angles of the reflection with respect to the light in the waste water are determined. An electroacoustic signal (ESA) or colloidal Vibration potential (CVP) in the waste water is determined.