Thermal highly stressed component i.e. electronic component, cooling method for in high power electronic circuits, involves producing under-cooled flow simmering with imbalance between fluid and vapor temperature in evaporator

摘要

The method involves forming a narrow discharge chamber between microstructures of a heat exchanger and a cover of a thermal highly stressed component. A fluid in lower temperature than a vapor is guided to condensers (3). A vapor bubble formation is increased by intensification of flow rate of the fluid between a micro-structured surface and a passage opening. Vapor bubbles are transported to the condensers and are back-cooled in an evaporator (2) in a liquid phase. An under-cooled flow simmering is produced with an imbalance between fluid and vapor temperature in the evaporator. An independent claim is also included for a device for cooling a thermal highly stressed component.