首页> 外国专利> Cooling body for cooling heat producing component of electronic system i.e. high-capacity server computer, has control circuit evaluating detected temperature and exchanging data with management component of electronic system

Cooling body for cooling heat producing component of electronic system i.e. high-capacity server computer, has control circuit evaluating detected temperature and exchanging data with management component of electronic system

机译:用于冷却电子系统发热组件(即大容量服务器计算机)的冷却体,具有控制电路,该电路评估检测到的温度并与电子系统的管理组件交换数据

摘要

The body (5) has a surface receiving thermal energy from a heat producing component. Another surface e.g. heat exchanger, delivers the received thermal energy at a coolant flow (7) such as gaseous coolant e.g. air, and liquid coolant e.g. water. A temperature sensor (8) is arranged on the latter surface and integrated into the cooling body for detecting of a temperature of the coolant. A control circuit (9) evaluates the detected temperature and exchanges data with a management component (3) of an electronic system, where the circuit includes a micro controller.
机译:主体(5)的表面接收来自发热部件的热能。另一个表面例如热交换器以冷却剂流(7)例如气态冷却剂的形式输送接收的热能。空气和液体冷却剂,例如水。温度传感器(8)布置在后表面上并且集成到冷却体中,用于检测冷却剂的温度。控制电路(9)评估检测到的温度,并与电子系统的管理组件(3)交换数据,其中该电路包括微控制器。

著录项

  • 公开/公告号DE102009011998A1

    专利类型

  • 公开/公告日2010-09-16

    原文格式PDF

  • 申请/专利权人 FUJITSU SIEMENS COMPUTERS GMBH;

    申请/专利号DE20091011998

  • 发明设计人 BOEHM CHRISTIAN;

    申请日2009-03-05

  • 分类号G06F1/20;H05K7/20;

  • 国家 DE

  • 入库时间 2022-08-21 18:28:21

相似文献

  • 专利
  • 外文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号