首页> 外国专利> Micromachining such as cleaning or modifying of body/powder layer with high-brilliance laser, comprises subjecting a surface of the body/powder layer with focused laser beams over beam switch, galvoscanner, line scanner and focusing optics

Micromachining such as cleaning or modifying of body/powder layer with high-brilliance laser, comprises subjecting a surface of the body/powder layer with focused laser beams over beam switch, galvoscanner, line scanner and focusing optics

机译:微加工,例如用高亮度激光清洁或修饰身体/粉末层,包括在光束开关,振镜,行扫描器和聚焦光学器件上使聚焦的激光束作用于身体/粉末层的表面。

摘要

The method for micromachining such as cleaning or modifying of a body (5) or a powder layer (6) with high-brilliance laser (1), comprises subjecting a surface of the body or powder layer with focused laser beams over a beam switch (2), galvoscanner (3), line scanner and focusing optics, which are arranged in the radiation path with respect to the laser with an average output of = 1 KW. The laser beams are diverted by the line scanner. Line change takes place by the galvoscanners, where the focused laser beam with a diameter of smaller than 100 mu m has a speed of greater than 50 m/s. The method for micromachining such as cleaning or modifying of a body (5) or a powder layer (6) with high-brilliance laser (1), comprises subjecting a surface of the body or powder layer with focused laser beams over a beam switch (2), galvoscanner (3), line scanner and focusing optics, which are arranged in the radiation path with respect to the laser with an average output of = 1 KW. The laser beams are diverted by the line scanner. Line change takes place by the galvoscanners, where the focused laser beam with a diameter of smaller than 100 mu m has a speed of greater than 50 m/s. Three-dimensional structures are produced by repeated successive line changes. An independent claim is included for device for micromachining of a body or a powder layer with a laser.
机译:微加工的方法,例如用高亮度激光(1)清洁或修饰物体(5)或粉末层(6),包括在光束开关( 2),振镜扫描仪(3),线扫描仪和聚焦光学器件,它们相对于激光在辐射路径中排列,平均输出> = 1 KW。激光束被线扫描仪转移。振镜扫描仪进行换线,直径小于100微米的聚焦激光束的速度大于50 m / s。微加工的方法,例如用高亮度激光(1)清洁或修饰物体(5)或粉末层(6),包括在光束开关( 2),振镜扫描仪(3),线扫描仪和聚焦光学器件,它们相对于激光在辐射路径中排列,平均输出> = 1 KW。激光束被线扫描仪转移。振镜扫描仪进行换线,直径小于100微米的聚焦激光束的速度大于50 m / s。三维结构是通过重复连续的线变化产生的。包括独立权利要求,其用于利用激光对物体或粉末层进行微加工的装置。

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