A curable synthetic resin composition containing an inorganic filler and an organic filler, a printed circuit board coated with a resist layer, and a process for producing the same

摘要

A curable synthetic resin mixture contains (I) 100 parts by weight of a curable synthetic resin; (II) 10 to 1200 parts by weight of an inorganic filler; and (III) 1 to 100 parts by weight of an organic filler having an elastic modulus of 1 to 2,000 (MPa) and an average particle diameter of 0.01 to 10 μm, wherein the weight ratio of the component (II) to the component (III) in the mixture is 1 to 41.