The device has a multilayer printed circuit board with a sensor (4) thermoconductively connected to a heat sink (6). Metallic areas of inner layers are electrically and thermally connected with a metallic area at a surface facing the sink. The areas form a temperature level similar to the sink in the layers that are spatially close to the sensor. The sink is thermoconductively connected with cooling surfaces of power semiconductors. An independent claim is also included for a method of determining temperature of a power semiconductor.
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