Embodiments of the capacitors dotes of means for reducing the constraints of the metallic material of the lower armature

摘要

The method involves realizing components and superposed interconnections metallic level (M5) on a substrate (100), and realizing an insulating layer (104) formed above the interconnections metallic level. A horizontal metallic zone e.g. metallic band (108), of the interconnection metallic level is formed such that isolating blocks e.g. isolating pins (106), resulting from the insulating layer are incorporated in the metallic zones, where the metallic zone forms an lower reinforcement part of a metal insulation metal condenser/capacitor. An independent claim is also included for microelectronic device.