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Creation of capacitors equipped with means to reduce the stresses in the metal material of their lower structures
Creation of capacitors equipped with means to reduce the stresses in the metal material of their lower structures
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机译:创造电容器,以降低其下部结构的金属材料中的应力
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摘要
The method for forming the microelectronic device having at least one two or three dimensional capacitor includes creating, on a substrate, a plurality of components and a number of superimposed metal interconnection levels. An insulating layer is formed above a metal interconnection level, and a horizontal metal zone of a next metal interconnection level in which one or more of the insulating blocks created from this insulating layer are incorporated is formed therein. The zone is designed to form a lower structural part of the capacitor.
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