首页> 外国专利> ELECTRONIC COMPONENT MOUNTING DEVICE AND METHOD OF TEACHING HEIGHT OF PICKUP HEAD

ELECTRONIC COMPONENT MOUNTING DEVICE AND METHOD OF TEACHING HEIGHT OF PICKUP HEAD

机译:电子元件安装装置和示教头高度的方法

摘要

PROBLEM TO BE SOLVED: To provide an electric component mounting device capable of teaching the height of a pickup head, even if a height sensor is not mounted on the pickup head, and to provide a method of teaching the height of the pickup head.;SOLUTION: The method of teaching the height of the pickup head includes, a step of detecting the height of each working stage (a relay table, a nozzle stocker and an ejector) from the height base point of a bonding head by using a contact sensor mounted on the bonding head; a step of detecting the height of the contact sensor from the height base point of the bonding head by using a non-contact sensor; a step of further detecting the height of the non-contact sensor from the height base point of the pickup head; and a step of calculating the height of the work stage, from the height base point of the pickup head by these height data calculation.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种即使在拾音头上未安装高度传感器也能够教导拾音头的高度的电气部件安装装置,并且提供教导拾音头的高度的方法。解决方案:教导拾取头高度的方法包括以下步骤:使用接触传感器从粘合头的高度基点检测每个工作台(中继台,喷嘴储料器和喷射器)的高度安装在粘合头上;通过使用非接触传感器从接合头的高度基点检测接触传感器的高度的步骤;从拾取头的高度基点进一步检测非接触式传感器的高度的步骤;以及通过这些高度数据计算从皮头的高度基点计算工作台高度的步骤。版权所有:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP2010171301A

    专利类型

  • 公开/公告日2010-08-05

    原文格式PDF

  • 申请/专利权人 PANASONIC CORP;

    申请/专利号JP20090013991

  • 发明设计人 HIRAKI TSUTOMU;

    申请日2009-01-26

  • 分类号H01L21/52;

  • 国家 JP

  • 入库时间 2022-08-21 19:03:17

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