METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD WITH THROUGH-HOLE, PRINTED CIRCUIT BOARD, AND PRESSURE-REDUCED AUTOCLAVE APPARATUS FOR FORMING MULTILAYER PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To manufacture a printed circuit board obtained by strongly bonding plastic to a metal by performing mechanical bonding in an atomic level.;SOLUTION: Many atomic vacancies and spaces exist on a boundary surface between plastic and a vapor-deposited metal. Meanwhile, each atomic vacancy in a processed metal foil is in an independent bubble state, and many vacancies exist in a vapor-deposited and plated thin film.;COPYRIGHT: (C)2010,JPO&INPIT