METHOD OF MANUFACTURING LAMINATED BODY FOR FORMING MULTILAYER PRINTED CIRCUIT BOARD, LAMINATED BODY FOR FORMING MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated body for forming a multilayer printed circuit board, in which a resistance of a conductive bump is reduced; the laminated body for forming the multilayer printed circuit board; and the multilayer printed circuit board.;SOLUTION: The method of manufacturing the laminated body for forming the multilayer printed circuit board comprises the steps of: (1) forming a conductive bump by applying a conductive paste including a binder resin and metal microparticles on a first metal sheet, and then heating the conductive paste to cure the conductive paste; (2) laminating a non-conductive sheet on the first metal sheet, then pressurizing the resultant product to make the conductive bump penetrate into the non-conductive sheet; (3) laminating the second metal sheet on the non-conductive sheet that is penetrated by the conductive bump, to obtain a non-pressurized laminated body; and (4) pressurizing the non-pressurized laminated body at 10-100 MPa while heating the body at 100-200C.;COPYRIGHT: (C)2012,JPO&INPIT