首页> 外国专利> METHOD FOR PRESSURE-BONDING FILM TO CASE, FILM TO BE PRESSURE-BONDED TO CASE, AND CASE WITH FILM PRESSURE-BONDED THERETO

METHOD FOR PRESSURE-BONDING FILM TO CASE, FILM TO BE PRESSURE-BONDED TO CASE, AND CASE WITH FILM PRESSURE-BONDED THERETO

机译:压接膜的方法,压接膜的方法以及用膜压接膜的方法

摘要

PROBLEM TO BE SOLVED: To provide a method of pressure-bonding a film to a case of three-dimensional structure dispensing with treatment of the end face of a case after pressure-bonded.;SOLUTION: The method of pressure-bonding the film to the case comprises a pressure-bonding step of holding a holding layer constituting the film, to pressure-bond a decorative layer constituting the film, to the case, and an eliminating step of eliminating the holding layer from the case while leaving the decorative layer pressure-bonded to the case. The film to be pressure bonded to the case has a decorative layer cut to the shape of the case and pressure-bonded to the case, and the holding layer eliminated from the case after pressure-bonded to the case together with the decorative layer.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种将膜压力粘合到三维结构的壳体上的方法,该方法无需对压力粘合后的壳体的端面进行处理;解决方案:将膜压力粘合至壳体的方法壳体包括:压接步骤,其将构成膜的保持层保持,以将构成膜的装饰层压接至壳体;以及消除步骤,其在保持装饰层压力的同时从壳体去除保持层。 -结合到案件。被压接至壳体的膜具有切成壳体形状并压接至壳体的装饰层,并且在与装饰层一起压接至壳体之后将保持层从壳体上去除。版权:(C)2010,日本特许厅和INPIT

著录项

  • 公开/公告号JP2010076346A

    专利类型

  • 公开/公告日2010-04-08

    原文格式PDF

  • 申请/专利权人 NEC PERSONAL PRODUCTS CO LTD;

    申请/专利号JP20080249598

  • 发明设计人 KAMIO TOSHISATO;

    申请日2008-09-29

  • 分类号B29C65/48;

  • 国家 JP

  • 入库时间 2022-08-21 19:02:02

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