首页> 外国专利> METHOD OF PRESSURE-BONDING FILM TO CASE, PRESSURE-BONDING TOOL, AND CASE WITH FILM PRESSURE-BONDED THERETO

METHOD OF PRESSURE-BONDING FILM TO CASE, PRESSURE-BONDING TOOL, AND CASE WITH FILM PRESSURE-BONDED THERETO

机译:压接膜的方法,压接工具以及膜压接的方法

摘要

PROBLEM TO BE SOLVED: To provide a method of pressure-bonding a film to a case of three-dimensional structure dispensing with treatment of the end face of a case after pressure-bonded.;SOLUTION: The method of pressure-bonding the film to the case comprises placing the case on a pressure-bonding tool shaped to the shape of the case and having a heatable projecting part near the peripheral edge of the case, pressure-bonding the film to the case placed on the pressure-bonding tool, and heating the projecting part to cut the film. The pressure-bonding tool for placing the case to which the film is pressure-bonded, is constituted to be shaped to the shape of the case and to have the heatable projecting part near the peripheral edge of the case. The case is placed on the pressure-bonding tool, and after the film is pressure-bonded, the projecting part formed around the pressure-bonding tool is heated to cut the film, thus constituting the case with the film pressure-bonded thereto.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种将膜压力粘合到三维结构的壳体上的方法,该方法无需对压力粘合后的壳体的端面进行处理;解决方案:将膜压力粘合至壳体的方法所述壳体包括:将所述壳体放置在形状与所述壳体的形状相同并且在所述壳体的周缘附近具有可加热的突出部的压接工具上;将所述膜压接至放置在所述压接工具上的所述壳体;以及加热突出部分以切膜。用于放置被压力粘合了膜的壳体的压力接合工具被构造成成形为壳体的形状并且在壳体的周缘附近具有可加热的突出部。将壳体放置在压接工具上,将膜压接后,加热在压接工具周围形成的突出部以切割膜,从而构成将膜压接于其上的壳体。版权:(C)2010,日本特许厅和INPIT

著录项

  • 公开/公告号JP2010076347A

    专利类型

  • 公开/公告日2010-04-08

    原文格式PDF

  • 申请/专利权人 NEC PERSONAL PRODUCTS CO LTD;

    申请/专利号JP20080249599

  • 发明设计人 KAMIO TOSHISATO;

    申请日2008-09-29

  • 分类号B29C65/00;

  • 国家 JP

  • 入库时间 2022-08-21 19:02:02

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