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Being production manner of the flexible printed wiring board which uses the flexible printed wiring board null roll

机译:作为使用挠性印刷线路板空卷的挠性印刷线路板的生产方式

摘要

PPROBLEM TO BE SOLVED: To provide a method for manufacturing flexible printed wiring boards which can manufacture flexible printed wiring boards of uniform quality and excellent durability against bending without complicated work using a roll-to-roll method and with excellent productivity and quality stability, and a flexible printed wiring board of excellent durability against bending even when the wiring density of conductor patterns at bending portions is high. PSOLUTION: The method for manufacturing flexible printed wiring boards comprises a first film-delivering step, a positioning step for positioning a coverlay film, a pre-bonding step for sequentially pre-bonding the coverlay film, a second film-delivering step, a thermo-compression bonding step for sequentially thermo-compression-bonding the coverlay film, and a bonding-layer curing step for curing the bonding layer by heat treatment. The flexible printed wiring board has such a construction in which the thicknesses of the bonding layers are almost the same on the upper-face side and the lower-face side of the conductive patterns 4 in bending portions in installing into an electronics apparatus. PCOPYRIGHT: (C)2006,JPO&NCIPI
机译:

要解决的问题:提供一种用于制造柔性印刷电路板的方法,该方法可以使用卷对卷方法制造质量均匀且抗弯曲的耐久性优异的柔性印刷电路板,而无需复杂的工作,并且具有优异的生产率和质量而且,即使在弯曲部的导体图案的配线密度高的情况下,也具有优异的耐弯曲性的挠性印刷线路板。

解决方案:用于制造挠性印刷线路板的方法包括第一膜输送步骤,用于定位覆盖膜的定位步骤,用于顺序地预粘结覆盖膜的预粘结步骤,第二膜输送步骤。依次进行热压粘合覆盖层膜的热压粘合步骤和用于通过热处理使粘合层固化的粘合层固化步骤。柔性印刷线路板具有这样的构造,其中,在安装到电子设备中时,在弯曲部分中的导电图案4的上表面侧和下表面侧,接合层的厚度几乎相同。

版权:(C)2006,JPO&NCIPI

著录项

  • 公开/公告号JP4525170B2

    专利类型

  • 公开/公告日2010-08-18

    原文格式PDF

  • 申请/专利权人 パナソニック株式会社;

    申请/专利号JP20040146278

  • 发明设计人 岡本 克也;中島 晃治;

    申请日2004-05-17

  • 分类号H05K3/28;H05K3/00;

  • 国家 JP

  • 入库时间 2022-08-21 19:01:32

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