Chip-type electronic component and method for manufacturing chip-type electronic component

摘要

PPROBLEM TO BE SOLVED: To provide an electronic chip component which is capable of preventing the permeation of a plating liquid into a ceramic element when forming a plating film on a terminal electrode on the front surface of the ceramic element, and is also capable of preventing the formation of the plating film on the ceramic element even if it is a low resistivity ceramic element, and which has an excellent wettability with respect to an adhesive, and also to provide a method of manufacturing the same. PSOLUTION: In the electronic chip component with the plating film formed on the electrode formed on the front surface of the ceramic element, a covering layer formed of a titanate-based coupling agent is formed at least in a part of the front surface of the ceramic element where no electrode is formed. PCOPYRIGHT: (C)2004,JPO