ULTRASONIC DEVELOPMENT PROCESSING METHOD, AND ULTRASONIC DEVELOPMENT PROCESSING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an ultrasonic development processing method allowing development in low impact, and capable of achieving reduction of a development time and improvement of development accuracy, and achieving improvement of a removal effect of scum remaining in a circuit pattern part; and a device therefor.;SOLUTION: This development processing device carrying out a development process by bringing a developer L into contact with a surface of a circuit pattern P of a board G subjected to an exposure treatment, for instance, mounting the developer thereon is provided with: an ultrasonic vibrator 7 arranged adjacently and oppositely to the circuit pattern of the board with the developer brought into contact therewith, and having an oscillation surface 7a of a region equal to or slightly larger than that of the circuit pattern; and a high-frequency drive power source 31 for the ultrasonic vibrator. The developer is mounted on the surface of the board, and thereafter a development process is carried out while transmitting ultrasonic vibration generated from the ultrasonic vibrator to the developer on the circuit pattern in a state where the oscillation surface of the ultrasonic vibrator is brought close to the circuit pattern, and brought into contact with the developer.;COPYRIGHT: (C)2010,JPO&INPIT