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ULTRASONIC DEVELOPMENT PROCESSING METHOD AND ULTRASONIC DEVELOPMENT PROCESSING DEVICE

机译:超声波显影处理方法及超声波显影处理装置

摘要

PROBLEM TO BE SOLVED: To provide an ultrasonic development processing method and an ultrasonic development processing device which allow for development with low impact while shortening the development time, and enhancing the development accuracy and the elimination effect of residual scum in the circuit pattern part.;SOLUTION: The ultrasonic development processing device performing development processing by bringing a developing solution into contact with the circuit pattern P surface of a substrate G subjected to exposure processing, e.g. by applying the developing solution thereto, comprises an ultrasonic vibrator 7B having an oscillation surface 7b which abuts against the substrate side surface near the circuit pattern of the substrate in contact with the developing solution, and a high frequency drive power supply 31 of the ultrasonic vibrator. In a state where the oscillation surface of the ultrasonic vibrator is abutting against the substrate side surface near the circuit pattern of the substrate after applying the developing solution to the substrate surface, development processing is performed by making an ultrasonic vibration generated from the ultrasonic vibrator propagate through the developing solution on the circuit pattern.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种超声波显影处理方法和超声波显影处理装置,其允许在低冲击的情况下显影,同时缩短显影时间,并提高显影精度和消除电路图案部分中残留的浮渣的效果。解决方案:超声波显影处理设备通过使显影液与经过曝光处理的基板G的电路图案P表面接触来执行显影处理。通过向其施加显影液,包括:超声振动器7B,其具有振动表面7b,该振动表面7b在与显影溶液接触的基板的电路图案附近紧靠基板侧表面;以及超声振动器的高频驱动电源31 。在将显影液施加到基板表面之后,在超声波振动器的振荡表面在基板的电路图案附近靠近基板侧表面的状态下,通过使由超声波振动器产生的超声波振动传播来进行显影处理。通过对电路图形的开发解决方案。;版权所有:(C)2013,日本特许厅&INPIT

著录项

  • 公开/公告号JP2013016857A

    专利类型

  • 公开/公告日2013-01-24

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LTD;

    申请/专利号JP20120213586

  • 申请日2012-09-27

  • 分类号H01L21/027;G03F7/30;B08B3/12;

  • 国家 JP

  • 入库时间 2022-08-21 17:00:50

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