首页>
外国专利>
1 atomic layer by deposition can be single-wafer processing equipment
1 atomic layer by deposition can be single-wafer processing equipment
展开▼
机译:1个原子层通过沉积可以单晶片加工设备
展开▼
页面导航
摘要
著录项
相似文献
摘要
PROBLEM TO BE SOLVED: To provide a treatment device which is capable of shortening a time required for one cycle of laminating an atomic layer, can be controlled by a computer, easily undergoes maintenance including the attachment or detachment of a component, and is easily disassembled and cleaned.;SOLUTION: The treatment device is equipped with a rotator 5a where a vent hole through which active gas penetrates is formed, a reactive gas supply chamber 102a where the rotator 5a is capable of rotating along its inner wall, a treatment chamber 101 equipped with a substrate holder 12 and an exhaust vent 13, and a reactive gas flow path Rra which connects the treatment chamber 101 to the reactive gas supply chamber 102a. When the vent hole of the rotator 5a is set coincident with the opening Ara of the reactive gas flow path Rra to the gas supply chamber 102a by controlling the rotation of the rotator 5a, the reactive gas can be introduced into the treatment chamber 101 through the reactive gas flow path Rra.;COPYRIGHT: (C)2005,JPO&NCIPI
展开▼