Method of manufacturing membrane element built-in printed circuit board, membrane element built-in printed wiring board

摘要

PROBLEM TO BE SOLVED: To improve connection reliability, and provide a method for manufacturing a film element built-in printed-wiring board that can simplify the manufacturing process.;SOLUTION: A dielectric paste is selectively applied (printed) on a principal surface of a copper foil 1, thus forming a dielectric region 2, and a conductive paste of the same composition is used to perform simultaneous printing by the same plate, thus forming a first capacitance electrode 3 for connecting a dielectric substance 2 and a pair of resistor electrodes 4 for connecting a resistor 5, and a resistor paste is printed so as to stride over this resistor electrodes 4, thus forming a resistor 5.;COPYRIGHT: (C)2006,JPO&NCIPI