Method for producing an electronic circuit board and a metal-coated polyimide composite and the composite

摘要

In metallized polyimide composite having a copper alloy layer or copper tie coat layer formed by a dry process or electroless plating on the surface of the polyimide film and the metal seed layer was formed by electroplating thereon, and the copper or equipped with a copper alloy layer or three layers of copper to 1 layer, in case copper alloy layer or copper is a three-layer to 2-layer, copper alloy plating layer is a concentrated portion of the impurities in the boundary layer of copper alloy or copper a, when a copper alloy layer or copper is one layer, no metal-coated polyimide composite concentration of impurities. Metal-coated polyimide composite that can be effectively suppressed (in particular, two-layer flexible laminate) peeling prevention in, from peeling off the surface of tin-plated copper layer in particular non-adhesive flexible laminate, electronic and manufacturing method of the same complex It is an object of the present invention to provide a method for manufacturing a circuit board.