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Metal covered polyimide composite, process for producing the composite, and process for producing electronic circuit board
Metal covered polyimide composite, process for producing the composite, and process for producing electronic circuit board
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机译:金属包覆的聚酰亚胺复合材料,该复合材料的制造方法以及电子电路板的制造方法
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摘要
Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer comprises three layers to one layer of the copper layer or copper alloy layer, and there is a concentrated portion of impurities at the boundary of the copper layer or copper alloy layer when the copper layer or copper alloy layer is three layers to two layers, and there is no concentrated portion of impurities when the copper layer or copper alloy layer is a single layer. Additionally provided are a method of producing the composite and a method of producing an electronic circuit board.
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