Copper alloy composite foil, high-frequency transmission circuit using the manufacturing method and the copper alloy composite foil

摘要

PROBLEM TO BE SOLVED: To provide a copper foil for high frequency propagation circuit provided with a small resistance layer such as of copper or/and silver on a surface to reduce transmission loss at high frequency and having excellent adhesive strength with a resin substrate as a foil for high frequency, and to provide its manufacturing method.;SOLUTION: In the copper alloy composite foil of this invention, a smooth layer of copper or/and silver is provided on at least one surface of a copper alloy rolled foil. It is preferable that thickness of the smooth layer of copper or/and silver of the copper foil is at least 0.01 μm or more and surface roughness of the smooth layer is 0.3-5.0 μm in Rz and 0.02-0.5 μm in Ra. It is preferable to apply either or both of roughening treatment and rust protection treatment to the smooth layer.;COPYRIGHT: (C)2006,JPO&NCIPI