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Pin Electronics Liquid Cooled Multi-module for High Performance, Low Cost Automated Test Equipment

机译:用于高性能,低成本自动化测试设备的Pin Electronics液冷多模块

摘要

In one embodiment, a channel board-to-DIB junction multi-module is provided which includes performance critical channel electronics modules within an enclosure encasing the plurality of performance critical channel electronics modules. A coolant distribution apparatus is provided within the enclosure to provide cooling within the enclosure. A channel board connection apparatus is located at a channel board end of the channel board-to-DIB junction multi-module and a cable-less connection apparatus is located at a DIB end of the channel board-to-DIB junction multi-module.
机译:在一个实施例中,提供了一种通道板到DIB结的多模块,该模块包括在封装多个性能关键通道电子模块的外壳内的性能关键通道电子模块。冷却剂分配装置设置在外壳内,以在外壳内提供冷却。通道板连接装置位于通道板与DIB的连接模块的通道板端,而无电缆连接装置位于通道板与DIB的连接模块的DIB端。

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