Investigation on the Impact on Thermal Performances of New Pin and Fin Geometries Applied to Liquid Cooling of Power Electronics

摘要

Liquid cooling of coldplates and baseplates appears to be the near-term solution for the current cooling demand of the power electronics market. Although well-known manufacturing methods can produce adequate coldplates and baseplates for liquid cooling, new manufacturing processes and associated new geometries could significantly improve the hydrodynamic and thermal performances of current solutions. A numerical and experimental investigation has been carried out in this study in order to evaluate the impact on the thermal performances of new pin and fin geometries applied to liquid cooling of power electronics. It is concluded that new geometries can provide a significant improvement on the thermal performances.