首页> 外国专利> ION IMPLANTATION FOR SUPPRESSION OF DEFECTS IN ANNEALED SiGe LAYERS

ION IMPLANTATION FOR SUPPRESSION OF DEFECTS IN ANNEALED SiGe LAYERS

机译:离子注入用于抑制退火SiGe层中的缺陷

摘要

A method for fabricating substantially relaxed SiGe alloy layers with a reduced planar defect density is disclosed The method of the present invention includes forming a strained Ge-containing layer on a surface of a Si-containing substrate; implanting ions at or below the Ge-containing layer/Si-containing substrate interface and heating to form a substantially relaxed SiGe alloy layer that has a reduced planar defect density. A substantially relaxed SiGe-on-insulator substrate material having a SiGe layer with a reduced planar defect density as well as heterostructures containing the same are also provided.
机译:公开了一种制造具有降低的平面缺陷密度的基本上松弛的SiGe合金层的方法。在含Ge的层/含Si的衬底界面处或下方注入离子,并加热以形成基本上松弛的SiGe合金层,该SiGe合金层的平面缺陷密度降低。还提供了基本上松弛的绝缘体上SiGe衬底材料,其具有降低的平面缺陷密度的SiGe层以及包含该SiGe层的异质结构。

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