IN-SITU MONITORING AND METHOD TO DETERMINE ACCUMULATED PRINTED WIRING BOARD THERMAL AND/OR VIBRATION STRESS FATIGUE USING A MIRRORED MONITOR CHIP AND CONTINUITY CIRCUIT

摘要

A monitoring system includes a monitor chip or chips soldered to a printed wiring board. By mirroring a function IC chip interface with the monitor chip, the consumed and remaining thermal/and or vibration-fatigue life of the function IC chip based on the life-environment actually experienced through monitoring of the monitor chip is readily determined. The monitor chip includes monitoring interconnections and/or circuitry which determines the number and/or location of failed-open solder terminations of the monitor chip.