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IC socket suitable for BGA/LGA hybrid package
IC socket suitable for BGA/LGA hybrid package
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机译:适用于BGA / LGA混合封装的IC插座
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摘要
An IC socket is provided with first and second contact pins and a socket body supporting said first and second contact pins. The first contact pin is used to establish a connection with a first terminal of a semiconductor package, while the second contact pin is used to establish a connection with a second terminal of said semiconductor package. The first and second terminals have different heights from a mount face of the semiconductor package.
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