Laminate-based RF modules for wireless applications typically have relatively small body size (<8mm) and LGA-style package terminals. In some applications, BGA-style packages are utilized as a way of populating both sides of the module substrate.For any given application, the end-product manufacturer will specify a maximum as-shipped component size. The x- and y-dimensions determine the areal packing density on the product motherboard. The z-dimension determines the thickness of the end-product. Components often need to fit under an electromagnetic interference (EMI) shield or other mechanical obstruction.
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